According to Lisa Su, head of semiconductor research at IBM, the company expects to launch chips for wireless devices later this year that use 40 per cent less power than previous chips.
"It opens up a range of applications and neat things we can do," Su told Reuters.
The technology works by drilling holes into a silicon wafer and filling them with metal, rather than trailing wires out to the side of the chip.
"The scope of innovation you have to deal with is much larger," she sadi.
"It's not just materials and atoms, but systems and how you put components together."
.jpg&h=140&w=231&c=1&s=0)
1.jpg&h=140&w=231&c=1&s=0)
.png&w=120&c=1&s=0){kind=logo}
HPE Networking Day Sydney
iTnews Resilience, Rewired Breakfast
RIMPA Live Convention 2026
iTnews Benchmark Security Awards 2026
iTnews State of Security Breakfast Sydney
